BS IEC 62047-31:2019 PDF

Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials

First page of standard BS IEC 62047-31:2019

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Title (English):

BS IEC 62047-31:2019

Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials

Document status:: Active
Format:: Electronic (PDF)
Publication date:: April 30, 2019
ICS:: 31.080.99
SKU:: BS IEC 62047-31:2019

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Abstract

What is BS IEC 62047 ‑ 31 - Micro-electromechanical systems (MEMS) materials about ? BS IEC 62047 ‑ 31 is the 31st part of an international standard used for semiconductor devices that specifies the bending test method. This test method helps in measuring the interfacial adhesion energy in microelectromechanical devices. BS IEC 62047-31 is a four-point bending test method for interfacial adhesion energy of layered MEMS materials. BS IEC 62047-31 specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics.

Who is BS IEC 62047 ‑

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BS IEC 62047-31:2019 PDF

Abstract

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Abstract

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