BS IEC 62047-35:2019 PDF

Semiconductor devices. Micro-electromechanical devices - Test method of electrical characteristics under bending deformation for flexible electromechanical devices

First page of standard BS IEC 62047-35:2019

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Title (English):

BS IEC 62047-35:2019

Semiconductor devices. Micro-electromechanical devices - Test method of electrical characteristics under bending deformation for flexible electromechanical devices

Document status:: Active
Format:: Electronic (PDF)
Publication date:: April 30, 2021
ICS:: 31.080.99
SKU:: BS IEC 62047-35:2019

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Abstract

What is BS IEC 62047 ‑ 35 - MEMS bending deformation testing about?

In the recent trend toward ubiquitous sensor society and the world of internet of things, demand for softer electronic devices is quickly expanding. That is what flexible micro-electromechanical devices are for. To operate such devices, the reliability of the individual devices is a critical concern. Especially in the case of flexible devices, robustness against bending deformation is an important issue which is shared among all the producers and users of such devices. BS IEC 62047 ‑ 35 is part of the IEC 62047 series on microelectromechanical devices. BS IEC 62047 ‑ 35 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or active micro components on the flexible film or embedded in the flexible film.

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What is BS IEC 62047 ‑ 35 - MEMS bending deformation testing about?

BS IEC 62047-35:2019 PDF

Abstract

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Abstract

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