IEC 60068-2-83:2025 PDF

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Title (English):

IEC 60068-2-83:2025

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Document status:: Active
Format:: Electronic (PDF)
Number of pages:: 124
Publication date:: May 27, 2025
Edition:: IEC IS 60068 edition 2 version 1
ICS:: 19.040

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Description (English):

IEC 60068-2-83:2025 is available as IEC 60068-2-83:2025 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes. NOTE Different solderability test methods for SMD are described in IEC 60068‑2‑58 and IEC 60068‑2‑69. IEC 60068‑2‑58 specifies visual evaluation using solder bath and reflow method, IEC 60068‑2‑69 specifies wetting balance evaluation using solder bath and solder globule method. This edition includes the following significant technical change with respect to the previous edition: a) revise Clause 5 to align with that in IEC 60068‑2‑20:2021.

Technical details

Technical committee: TC 91 - Electronics assembly technology
SKU: IEC 60068-2-83:2025

Abstract

Overview

IEC 60068-2-83:2025 - Environmental testing, Part 2-83 - defines methods for solderability testing of electronic components for surface mounting devices (SMD) using the wetting balance method with solder paste. The 2025 edition is published as an RLV (Redline Version) showing technical changes versus the previous edition, including a revision of Clause 5 to align with IEC 60068‑2‑20:2021. The standard is intended for comparative investigation of wettability of metallic or metallized terminations; results are not specified as absolute pass/fail criteria.

Key Topics and Requirements

Scope and intent: Comparative wetting-balance evaluation using solder paste for SMD terminations; guidance on equipment, procedures and data presentation.
Test methods covered:
- Quick heating method
- Synchronous method
- Temperature profile method
Test stages and preparation:
- Preconditioning of components
- Solder paste selection and handling
- Test jig plate and specimen holder design
- Equipment requirements (measuring, heating, lift systems)
Test execution and output:
- Immersion/withdrawal conditions, feed of solder paste
- Temperature control and profiling
- Data acquisition, typical output signal shapes, and result presentation
Data interpretation:
- Characterisation parameters and examples
- Informative annexes for reading output data and applying corrections
- Caveats and influences (solder paste, component construction) on results
Documentation: Annexes include normative equipment specifications and informative guidance for corrections, caveats and example interpretations.

Applications and Who Uses It

IEC 60068-2-83:2025 is useful for:

Component manufacturers validating SMD terminal finishes and new solder paste formulations.
Contract manufacturers and PCB assemblers evaluating wetting behaviour in paste-based processes (reflow-prone environments).
Test laboratories and quality teams performing comparative solderability characterisation for reliability assessment.
Procurement and reliability engineers who need comparative data to select components and solder materials.

Practical uses include comparing termination finishes, troubleshooting poor wetting in reflow processes, screening new component lots, and supporting supplier qualification.

Related Standards

IEC 60068-2-58 - solderability testing for SMD using solder bath and reflow with visual evaluation.
IEC 60068-2-69 - wetting balance evaluation using solder bath and solder globule method.
IEC 60068‑2‑20:2021 - referenced alignment for preconditioning procedures (Clause 5).

Keywords: IEC 60068-2-83:2025, solderability testing, wetting balance, solder paste, SMD, surface mount devices, environmental testing, solderability methods.

Related standards

Standards mentioned in the description

Abstract

Overview

Key Topics and Requirements

Scope and intent: Comparative wetting-balance evaluation using solder paste for SMD terminations; guidance on equipment, procedures and data presentation.
Test methods covered:
- Quick heating method
- Synchronous method
- Temperature profile method
Test stages and preparation:
- Preconditioning of components
- Solder paste selection and handling
- Test jig plate and specimen holder design
- Equipment requirements (measuring, heating, lift systems)
Test execution and output:
- Immersion/withdrawal conditions, feed of solder paste
- Temperature control and profiling
- Data acquisition, typical output signal shapes, and result presentation
Data interpretation:
- Characterisation parameters and examples
- Informative annexes for reading output data and applying corrections
- Caveats and influences (solder paste, component construction) on results
Documentation: Annexes include normative equipment specifications and informative guidance for corrections, caveats and example interpretations.

Applications and Who Uses It

IEC 60068-2-83:2025 is useful for:

Component manufacturers validating SMD terminal finishes and new solder paste formulations.
Contract manufacturers and PCB assemblers evaluating wetting behaviour in paste-based processes (reflow-prone environments).
Test laboratories and quality teams performing comparative solderability characterisation for reliability assessment.
Procurement and reliability engineers who need comparative data to select components and solder materials.

Practical uses include comparing termination finishes, troubleshooting poor wetting in reflow processes, screening new component lots, and supporting supplier qualification.

Related Standards

IEC 60068-2-58 - solderability testing for SMD using solder bath and reflow with visual evaluation.
IEC 60068-2-69 - wetting balance evaluation using solder bath and solder globule method.
IEC 60068‑2‑20:2021 - referenced alignment for preconditioning procedures (Clause 5).

Keywords: IEC 60068-2-83:2025, solderability testing, wetting balance, solder paste, SMD, surface mount devices, environmental testing, solderability methods.

IEC 60068-2-83:2025 PDF

Technical details

Abstract

Overview

Key Topics and Requirements

Applications and Who Uses It

Related Standards

Related standards

Abstract

Overview

Key Topics and Requirements

Applications and Who Uses It

Related Standards

Related standards

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to s…

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