IEC 61837-2:2018 PDF

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures

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Title (English):

IEC 61837-2:2018

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures

Document status:: Active
Format:: Electronic (PDF)
Number of pages:: 99
Publication date:: June 18, 2026
Edition:: IEC IS 61837 edition 3 version 1
ICS:: 01

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Description (English):

IEC 61837-2:2018 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition: a. revision of the figures to match the notation of the drawings of IEC 61240:2016; b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C. As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.

Technical details

Technical committee: TC 49 - Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
SKU: IEC 61837-2:2018

Abstract

Overview

IEC 61837-2:2018 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (Edition 3.0, 2018) defines standard outlines and terminal lead connection recommendations for surface-mounted piezoelectric frequency-control devices housed in ceramic enclosures. This part is based on IEC 61240:2016 and updates the previous edition by revising figure notation and adding seven enclosure types, bringing the total to 45 enclosure types (listed in Table 1).

Key topics and requirements

Scope: Applies to completed SMD devices for frequency control and selection in ceramic packages; specifies outline shapes, terminal lead structures and recommended land/terminal arrangements.
Enclosure configurations: Uses descriptive configuration symbols:
- DCC (dual chip carrier)
- QCC (quad chip carrier)
Designation system: A structured code (A B C D D’ E) is used to identify:
- configuration symbol (DCC/QCC)
- terminal lead structure (leadless default)
- number of terminal leads
- serial figure number
- terminal land arrangement (A/B/C variations for DCC, A/B for QCC)
Ceramic enclosure dimensions: Provides standardized dimensions that apply only where they meet IEC 61240 requirements; intended to ensure consistent mechanical outlines and PCB footprint compatibility.
Lead connections: Recommends terminal lead connection patterns and land arrangements for reliable soldering and mechanical mounting (leadless metal film terminals).
Edition changes: Figures revised to align with IEC 61240:2016 notation; seven new enclosures added - DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.

Applications and who uses it

Component manufacturers - define package outlines, terminal metallurgy and produce compliant ceramic SMD resonators/crystals.
PCB designers and layout engineers - use standardized land patterns and enclosure outlines to ensure correct footprints and soldering reliability.
Product integrators and OEMs - select compatible SMD frequency-control parts and ensure interchangeability across suppliers.
Procurement and quality assurance - verify supplier parts conform to internationally recognized outlines and connection recommendations.
Test and reliability engineers - assess mechanical and solder joint robustness based on standard terminal arrangements.

Related standards

IEC 61240:2016 - Piezoelectric devices - Preparation of outline drawings of SMD devices for frequency control and selection - General rules (normative reference for IEC 61837-2).
Other parts of the IEC 61837 series cover non-ceramic enclosures and additional terminal/outline conventions.

Keywords: IEC 61837-2, surface mounted piezoelectric devices, SMD, ceramic enclosures, frequency control, terminal lead connections, DCC, QCC, IEC 61240, enclosure types, PCB footprint.

Related standards

Mentioned in the description and other IEC standards

Abstract

Overview

Key topics and requirements

Scope: Applies to completed SMD devices for frequency control and selection in ceramic packages; specifies outline shapes, terminal lead structures and recommended land/terminal arrangements.
Enclosure configurations: Uses descriptive configuration symbols:
- DCC (dual chip carrier)
- QCC (quad chip carrier)
Designation system: A structured code (A B C D D’ E) is used to identify:
- configuration symbol (DCC/QCC)
- terminal lead structure (leadless default)
- number of terminal leads
- serial figure number
- terminal land arrangement (A/B/C variations for DCC, A/B for QCC)
Ceramic enclosure dimensions: Provides standardized dimensions that apply only where they meet IEC 61240 requirements; intended to ensure consistent mechanical outlines and PCB footprint compatibility.
Lead connections: Recommends terminal lead connection patterns and land arrangements for reliable soldering and mechanical mounting (leadless metal film terminals).
Edition changes: Figures revised to align with IEC 61240:2016 notation; seven new enclosures added - DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.

Applications and who uses it

Component manufacturers - define package outlines, terminal metallurgy and produce compliant ceramic SMD resonators/crystals.
PCB designers and layout engineers - use standardized land patterns and enclosure outlines to ensure correct footprints and soldering reliability.
Product integrators and OEMs - select compatible SMD frequency-control parts and ensure interchangeability across suppliers.
Procurement and quality assurance - verify supplier parts conform to internationally recognized outlines and connection recommendations.
Test and reliability engineers - assess mechanical and solder joint robustness based on standard terminal arrangements.

Related standards

IEC 61240:2016 - Piezoelectric devices - Preparation of outline drawings of SMD devices for frequency control and selection - General rules (normative reference for IEC 61837-2).
Other parts of the IEC 61837 series cover non-ceramic enclosures and additional terminal/outline conventions.

Keywords: IEC 61837-2, surface mounted piezoelectric devices, SMD, ceramic enclosures, frequency control, terminal lead connections, DCC, QCC, IEC 61240, enclosure types, PCB footprint.

IEC 61837-2:2018 PDF

Technical details

Abstract

Overview

Key topics and requirements

Applications and who uses it

Related standards

Related standards

Abstract

Overview

Key topics and requirements

Applications and who uses it

Related standards

Related standards

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