Overview
IEC 61967-8:2023 - Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method - defines a standardized method to measure radiated electromagnetic emissions from an integrated circuit (IC) using an IC stripline. The device-under-test (DUT) is mounted on an EMC test board (PCB) between the stripline active conductor and the ground plane. The 2023 edition removes the previously stated 150 kHz–3 GHz scope and extends the upper usable frequency to 6 GHz or higher where the defined requirements are satisfied.
Key topics and technical requirements
- Test principle: TEM waveguide measurement based on IEC 61000-4-20; the stripline guides a transverse electromagnetic (TEM) mode to produce a defined field between active conductor and ground.
- Test set-up: IC mounted on a standard EMC test board between active conductor and enlarged ground plane; optional shielded enclosure (open vs closed stripline).
- Equipment & measurements: RF measuring instruments, preamplifiers, 50 Ω terminations, and system gain verification are addressed to ensure repeatable radiated emission measurements.
- Test conditions: Defined supply voltage, ambient conditions, operational checks, and stripline RF characteristic verification prior to measurement.
- Frequency capability: Upper usable frequency extended to 6 GHz or above if stripline and test equipment meet the standard’s requirements.
- Reporting: Requirements for test reports, measurement conditions, and presentation of IC emissions reference levels.
- Annexes: Normative description of IC stripline geometry and characteristic impedance, plus informative guidance on emission level specification and result presentation.
Practical applications and who uses this standard
IEC 61967-8 is intended for:
- IC manufacturers performing radiated emission characterization and design-for-EMC checks.
- EMC test laboratories implementing repeatable, comparable stripline measurements for integrated circuits.
- Design and compliance engineers validating PCB/IC packaging interactions and pre-compliance testing.
- Regulatory and certification bodies requiring standardized, traceable measurement methods for IC-level emissions.
Benefits include reproducible IC-level radiated emission data, earlier EMC risk identification, and a standardized basis for comparing IC designs or process variations.
Related Standards (if applicable)
- IEC 61967-1 - Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions
- IEC 61967-2 - Measurement of radiated emissions - TEM cell and wideband TEM cell method
- IEC 61000-4-20 - EMC - Emission and immunity testing in TEM waveguides
Keywords: IEC 61967-8, IC stripline, radiated emissions, integrated circuits, EMC test board, PCB, TEM waveguide, 6 GHz, EMC testing, radiated emission measurement.
Open preview (PDF)Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
