Overview
IEC 62047-25:2016 is an international standard published by the International Electrotechnical Commission (IEC), focused on semiconductor devices and, specifically, micro-electromechanical systems (MEMS). This part of the IEC 62047 series delineates an in-situ testing method for measuring the bonding strength of micro bonding areas formed using silicon-based MEMS fabrication technology. The standard addresses both pull-press and shearing strength tests, providing methodologies for evaluating the mechanical robustness of micro bonding areas fabricated using micromachining processes. These tests are crucial for ensuring the reliability and durability of MEMS devices, which are increasingly integral to a range of high-precision and miniaturized applications.
Key Topics
- In-situ Testing Methodology: The standard specifies procedures for conducting pull-press and shearing strength tests directly on micro bonding areas without the need for complex sample preparation.
- Testing Structure Design: Guidelines are provided for designing test structures, including considerations to ensure that failures occur in the bonding area rather than the test arm itself.
- Bulk Silicon Fabrication Requirements: Recommendations are included for fabricating testing structures from bulk silicon, which should match the properties and processes used in actual MEMS device production.
- Testing Environment: Requirements emphasize the need for a stable, contamination-free environment to achieve reliable measurements.
- Data Interpretation: The standard facilitates the calculation of bonding strength based on the observed mechanical failure and predefined design tables, linking results directly to test structure parameters.
Applications
- MEMS Device Reliability Assessment: By enabling precise measurement of bonding strength, this standard supports the qualification and quality assurance of MEMS components in fields such as automotive sensors, medical devices, and consumer electronics.
- Process Control in Fabrication: Foundries can implement the testing method as an in-line or end-of-line check to monitor consistency and detect fabrication issues like contamination, defects, and thermal stress-induced degradation.
- Design Verification: MEMS designers gain quantitative feedback on bonding integrity, allowing iterative improvements in device architecture and robustness.
- Research and Development: Laboratories can use the standardized methodology to compare results, enhance repeatability, and support innovation in MEMS bonding techniques.
Related Standards
- IEC 62047-1: Defines the general terms and definitions for micro-electromechanical devices, serving as a foundational reference for terminology used in IEC 62047-25.
- ISO 10012: Specifies requirements for measurement management systems, ensuring that measurement processes and equipment used in accordance with IEC 62047-25 are reliable and valid.
- Other IEC 62047 Parts: Cover various aspects of silicon-based MEMS fabrication technology, characterization, and performance, complementing the measurement methods defined in this part.
Keywords: IEC 62047-25, MEMS bonding strength measurement, micro bonding area, silicon-based MEMS, pull-press testing, shearing strength, in-situ testing, semiconductor devices, MEMS reliability, microfabrication testing standards.
By implementing IEC 62047-25:2016, manufacturers and designers of silicon-based MEMS devices can ensure robust quality control, enable accurate reliability assessments, and facilitate consistent reporting across the MEMS industry.
Open preview (PDF)Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area