Overview - IEC 62047-27:2017 (micro-chevron-test for glass frit bonds)
IEC 62047-27:2017 specifies a standardized method to assess bond strength of glass frit bonded structures using the micro-chevron-test (MCT). The standard defines the experimental principle (mode I crack opening), recommended sample geometry, test setup (actuator, force transducer, studs, alignment and data acquisition), and procedures for analysis and reporting. The micro-chevron-test is used to determine the fracture toughness (KIC) of brittle bond interfaces with high precision and low variance, making it suitable for process development and quality assurance of MEMS and semiconductor wafer bonds.
Key topics and technical requirements
- Test principle: Mode I (opening) crack initiation and propagation in specially designed micro-chevron samples, where applied tensile load increases the stress intensity factor until failure.
- Specimen design: Preferred geometries and guidance for deviating geometries are provided so results remain comparable. The document targets symmetrically bonded silicon–silicon stacks.
- Test setup components: Requirements for actuator/displacement control, force transducers (load cells), stud application for tensile loading, mounting and alignment systems, and data acquisition.
- Alignment and loading: Emphasis on precise specimen alignment to avoid shear or mixed-mode loading of the glass frit bond interface.
- Data analysis: Calculation of fracture toughness KIC from peak load and geometry factors, criteria for valid tests, statistical evaluation of test series, and minimum reporting information.
- Quality and reproducibility: Procedures and parameter controls (test velocity, environmental conditions, specimen verification) to ensure low variance and high-precision measurements.
Applications - practical value and use cases
- Process optimization for glass frit bonding in MEMS packaging and wafer-level encapsulation.
- Reliability and durability assessment for automotive, industrial and consumer MEMS where long lifecycles are required.
- Incoming/outgoing quality assurance (QA) and failure analysis of bond interfaces in semiconductor devices.
- Research and development studies of material and process parameters affecting bond fracture toughness.
Who should use this standard
- MEMS and semiconductor packaging engineers
- Materials scientists and fracture mechanics researchers
- Reliability and QA laboratories performing bond strength tests
- R&D teams developing glass frit bonding processes and tooling
Related standards and resources
- Refer to other parts of the IEC 62047 series for additional MEMS test methods and contextual standards.
- IEC publications and Electropedia provide terminological and bibliographic resources relevant to micro-mechanical testing and semiconductor device standards.
Keywords: IEC 62047-27:2017, micro-chevron-test, glass frit bonded structures, bond strength test, fracture toughness KIC, MEMS, wafer bonds, bond interface testing, quality assurance.
Open preview (PDF)Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
