Overview
IEC 62047-30:2017 specifies standardized measurement methods and a reporting schema for the electro‑mechanical conversion characteristics of MEMS piezoelectric thin film. The standard applies to piezoelectric thin films fabricated by MEMS processes and focuses on characterizing transverse piezoelectric behavior for micro‑sensors and micro‑actuators. It defines test‑bed configurations, measurement procedures for direct and converse effects, and the content required in test reports.
Key Topics and Requirements
- Scope: Measurement of electro‑mechanical conversion characteristics of piezoelectric thin film (MEMS process).
- Test bed configuration: Defines functional blocks and components such as the unimorph cantilever (beam), clamp, electrodes, linear actuator, displacement meter, electrical measurement instruments (voltmeter, charge meter, oscilloscope, lock‑in amplifier) and power source for converse measurements.
- Measurement principles: Procedures for:
- Direct transverse piezoelectric coefficient - derived from generated charge/voltage under mechanical strain (using tip displacement from a linear actuator).
- Converse transverse piezoelectric coefficient - derived from induced strain/stress caused by applied electric field/voltage.
- Specimen and preparation: Applies to unimorph beams (piezoelectric thin film on a substrate). Annex material provides guidance on sample preparation, poling treatment and neutral‑plane calculations.
- Data and reporting schema: Mandatory and optional test report items, including measured coefficients (d‑form and e‑form), input/output waveforms, displacement data, capacitance, dielectric loss and material properties used in calculations.
- Validation checks: Clamping condition verification (e.g., mechanical Q factor at resonance) and synchronization of electrical measurements with mechanical displacement.
Practical Applications and Who Uses This Standard
- Device manufacturers and MEMS fabs: For process control, acceptance testing and qualification of piezoelectric thin films used in actuators and sensors.
- Test and calibration laboratories: To provide reproducible, traceable characterization of piezoelectric thin films.
- R&D and materials science teams: For comparing material formulations, optimizing poling processes and validating simulation models.
- System integrators and product designers: To obtain reliable electro‑mechanical parameters for design, modelling and performance prediction of MEMS sensors (e.g., inertial sensors, acoustic MEMS) and micro‑actuators in consumer, industrial, automotive and medical applications.
Related Standards (if applicable)
- Other parts of the IEC 62047 series on semiconductor MEMS devices (see IEC catalogue for the series).
- IEC Electropedia and ISO/IEC directives referenced for terminology and standards development practices.
Keywords: IEC 62047-30:2017, MEMS piezoelectric thin film, measurement methods, electro-mechanical conversion characteristics, transverse piezoelectric coefficient, unimorph cantilever, MEMS sensors, micro-actuators.
Open preview (PDF)Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
