Overview - IEC 62899-301-1:2017 (Printed electronics, Rigid plate master measurement)
IEC 62899-301-1:2017 is an international measurement standard for printed electronics contact-printing masters. It defines terms and repeatable measurement methods for the external dimensions of a rigid plate master used in contact printing processes. The standard covers geometrical size (edge length, squareness, straightness, thickness), flatness of plate substrates, and surface roughness of the plate master.
Key topics and technical requirements
- Geometry and terminology
- Defines reference edges, machine direction (MD), cross direction (CD) and orientation corner for consistent referencing of measurements.
- Geometrical size measurements
- Procedures for measuring edge length, edge squareness, edge straightness and thickness.
- Two procedural paths (Procedure A and Procedure B) are provided, with guidance on measuring instruments and reporting.
- Flatness measurement
- Methods for assessing substrate flatness, including measurement locations and environmental/control considerations.
- Illustrations and example reporting formats for flatness profiles.
- Surface roughness measurement
- Defines measurement approaches for surface roughness using mechanical and optical stylus instruments, calibration, measurement conditions and reporting.
- Instruments and calibration
- Recommends appropriate measuring equipment: coordinate measuring machines (CMM), mechanical stylus and optical stylus instruments.
- Specifies importance of instrument calibration and controlled measurement environment for reproducible results.
- Reporting
- Examples and templates for reporting measurement results (profiles, flatness and roughness summaries) to support quality control and supplier communication.
Practical applications and users
Who uses IEC 62899-301-1:2017:
- Printed electronics manufacturers producing flexible and rigid printed circuits where master precision affects final device performance.
- Printing master manufacturers and tooling suppliers validating plate master geometry and surface finish.
- Equipment vendors developing master-making and inspection systems (CMM, optical/metrological tools).
- Quality, metrology and process engineers who require standardized measurement methods for production control, supplier acceptance and traceability.
Why it matters:
- Ensures consistent measurement of plate master attributes that directly affect print registration, feature fidelity and yield in contact printing processes (gravure, offset, screen).
- Facilitates supplier-vendor communication and quality assurance across the printed electronics supply chain.
Related standards
- IEC 62899 series (printed electronics) - this part is one element of the broader printed electronics standard family. Consult the IEC catalogue for other parts in the series.
Open preview (PDF)Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension
