ISO 9453:1990 PDF
Soft solder alloys — Chemical compositions and forms
Soft solder alloys — Chemical compositions and forms
- Document status:
- Withdrawn
- Format:
- Electronic (PDF)
- Number of pages:
- 4
- Publication date:
- November 15, 1990
- Edition:
- ISO IS 9453 edition 1 version 1
- ICS:
- 25.160.50
Specifies the requirements for chemical composition for the following soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; lead-silver, with and without tin.
Technical details
- Technical committee
- ISO/TC 44/SC 12 - Soldering materials
- SKU
- ISO 9453:1990


