ISO 9453:2006 PDF
Soft solder alloys — Chemical compositions and forms
Title (English):
ISO 9453:2006
Soft solder alloys — Chemical compositions and forms
- Document status:
- Withdrawn
- Format:
- Electronic (PDF)
- Number of pages:
- 10
- Publication date:
- September 22, 2006
- Edition:
- ISO IS 9453 edition 2 version 1
- ICS:
- 25.160.50
Description (English):
ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; tin-antimony; tin-bismuth; tin-copper, with and without silver; tin-indium, with and without silver and bismuth; tin-silver, with and without copper and bismuth; tin-zinc, with and without bismuth. ISO 9453:2006 also includes an indication of the forms generally available.
Technical details
- Technical committee
- ISO/TC 44/SC 12 - Soldering materials
- SKU
- ISO 9453:2006
