ISO 9453:2014 PDF
Soft solder alloys — Chemical compositions and forms
Soft solder alloys — Chemical compositions and forms
- Document status:
- Withdrawn
- Format:
- Electronic (PDF)
- Number of pages:
- 16
- Publication date:
- August 18, 2014
- Edition:
- ISO IS 9453 edition 3 version 1
- ICS:
- 25.160.50
ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
Technical details
- Technical committee
- ISO/TC 44/SC 12 - Soldering materials
- SKU
- ISO 9453:2014



