ISO 9455-17:2002 PDF
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
Open preview (PDF)Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residuesSoft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
- Document status:
- Withdrawn
- Format:
- Electronic (PDF)
- Number of pages:
- 21
- Publication date:
- December 9, 2002
- Edition:
- ISO IS 9455 edition 1 version 1
- ICS:
- 25.160.50
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders. This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
Technical details
- Technical committee
- ISO/TC 44/SC 12 - Soldering materials
- SKU
- ISO 9455-17:2002
