Overview
IEC 62047-11:2013 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a precise test method for measuring the coefficients of linear thermal expansion (CLTE) of thin, free-standing materials used in micro-electromechanical systems (MEMS). This standard focuses on materials such as metals, ceramics, and polymers with very small dimensions-lengths from 0.1 mm to 1 mm, widths from 10 micrometers to 1 mm, and thicknesses from 0.1 micrometers to 1 mm. It is applicable for determining CLTE within the temperature range from room temperature up to 30% of the material’s melting temperature.
This test method is integral for characterizing the thermal properties of structural materials used in MEMS devices and micromachines, enabling manufacturers and researchers to evaluate material behavior accurately under thermal stress, which is critical for device reliability and performance.
Key Topics
- Scope and Applicability: Defines the size ranges and material types suitable for CLTE measurement, focusing on free-standing MEMS materials.
- Test Piece Fabrication: Detailed requirements on the shape, dimensions, and preparation of test specimens consistent with actual MEMS structures to minimize size effects. Fabrication methods align with MEMS device processes.
- Measurement Methods: Describes both in-plane and out-of-plane testing techniques, including measurement principles, apparatus setup, and thermal strain detection.
- Temperature Range and Control: Specifies testing from room temperature to 30% of the melting temperature, ensuring relevant thermal conditions for realistic applications.
- Data Analysis: Linear least squares and terminal-based calculations to evaluate thermal expansion coefficients from measurement data.
- Reporting: Requirements on comprehensive test reporting, including test piece dimensions, measured CLTE, temperature ranges, and environmental conditions.
Applications
IEC 62047-11:2013 serves as a vital guideline in sectors and processes involving micro-electromechanical systems (MEMS) and micromachines, where precise thermal expansion knowledge of materials is essential. Typical applications include:
- MEMS Device Manufacturing: Ensuring materials used for components exhibit predictable thermal expansion, reducing risk of mechanical failure due to thermal stress.
- Material Research and Development: Facilitating accurate characterization of new thin-film or miniature materials for micro-scale devices.
- Quality Control: Verifying consistency in production batches by comparing CLTE values against standard benchmarks.
- Microsystems Design: Enabling designers to simulate and compensate for thermal effects in microsystem assemblies.
- Thermal Compatibility Testing: Assessing how different MEMS structural materials interact under temperature changes to optimize multi-material system integration.
This standard supports global interoperability and reliability of MEMS devices by underpinning thermal property testing with a harmonized methodology.
Related Standards
- IEC 62047-3: Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile-testing. Essential for understanding test piece fabrication consistent with IEC 62047-11 requirements.
- ISO/IEC Directives Part 2: Governs the drafting and structure of IEC standards, ensuring uniformity and clarity.
- Other parts of IEC 62047 series: Cover various attributes and testing methods for MEMS devices and semiconductor micro-electromechanical components.
Keywords
IEC 62047-11, linear thermal expansion, CLTE, MEMS materials testing, micro-electromechanical systems, thin-film materials, free-standing test piece, thermal strain measurement, microdevice reliability, semiconductor standards, thermal deformation, MEMS fabrication process, in-plane/out-of-plane test method.
By adhering to IEC 62047-11:2013, manufacturers and researchers gain a robust, internationally accepted method for precise thermal expansion measurements, which is crucial to the continued innovation and dependability of MEMS technologies worldwide.
Open preview (PDF)Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
