Overview
The IEC 62047-2:2006 standard, published by the International Electrotechnical Commission (IEC), specifies the method for tensile testing of thin film materials used primarily in micro-electromechanical systems (MEMS), micromachines, and related semiconductor devices. These thin film materials typically have dimensions shorter than 1 mm in length and width, and a thickness less than 10 micrometers (µm). Due to the unique production methods such as deposition, etching, and photolithography combined with their micron-scale dimensions, specialized testing techniques are necessary to accurately evaluate their mechanical properties.
This standard provides a comprehensive testing method that ensures high accuracy and repeatability in assessing the tensile strength, elongation, and stress-strain behavior of thin film materials critical for MEMS structural components.
Key Topics
-
Scope and Application
The method applies exclusively to thin films used in MEMS and semiconductor micro-devices, offering detailed guidelines suited for materials with tiny dimensions and fabricated via micro-machining.
-
Test Methodology
Detailed procedures include test piece gripping techniques, loading methods, and test speed parameters optimized for fragile, micron-sized test specimens.
-
Measurement Techniques
Precision in force measurement and elongation tracking is addressed, ensuring that stress-strain curves accurately reflect material performance under tensile load.
-
Environmental Control
The standard emphasizes controlling test environment parameters to maintain consistency and reliability in measurement outcomes.
-
Test Specimen Design
Specifications for test piece shape, thickness, and dimensional standards are provided, including requirements for gauge marks facilitating elongation measurement.
-
Report Requirements
Guidelines for documenting test conditions, specimen details, and results to ensure clarity and reproducibility in reporting tensile test data.
Applications
This IEC standard is vital for:
-
MEMS Industry
Ensuring the mechanical reliability of thin film materials used in sensors, actuators, and micro-devices.
-
Micromachine Fabrication
Validating the structural integrity of thin films in high-precision micro-scale mechanical components.
-
Semiconductor Device Manufacturing
Characterizing material properties of thin films within semiconductor packaging and device layers.
-
Research and Development
Providing a benchmark tensile testing method for academic and industrial labs working on novel thin film materials or MEMS components.
-
Quality Control
Standardizing mechanical testing protocols to guarantee consistent product performance and safety.
Related Standards
IEC 62047-2 forms part of the broader IEC 62047 series dedicated to Semiconductor devices – Micro-electromechanical devices, which includes other parts covering different testing methods and device characteristics. Complementary standards may include:
- IEC 62047-1 – General requirements and terminology for MEMS devices.
- Other IEC standards related to microfabrication, material characterization, and device testing.
- ISO/IEC Directives Part 2 – Guidance on standard drafting methodology applied in this document.
Applying IEC 62047-2:2006 ensures alignment with internationally recognized testing norms enhancing compatibility and market acceptance of MEMS-related products worldwide.
Keywords: IEC 62047-2, tensile testing, thin film materials, MEMS testing method, micro-electromechanical devices, semiconductor devices, micromachines, thin film mechanical properties, stress-strain curve, microfabrication testing standards, elongation measurement, tensile strength testing, IEC standards for MEMS.
Open preview (PDF)Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
