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IEC 62047-36:2019 PDF

Semiconductor devices - Micro-electromechanical devices - Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

First page of standard IEC 62047-36:2019Open preview (PDF)Semiconductor devices - Micro-electromechanical devices - Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Title (English):
IEC 62047-36:2019

Semiconductor devices - Micro-electromechanical devices - Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

Document status:
Active
Format:
Electronic (PDF)
Number of pages:
16
Publication date:
April 5, 2019
Edition:
IEC IS 62047 edition 1 version 1
ICS:
31.080.99
Description (English):

IEC 62047-36:2019 (E) specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under electrical stress, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of converse piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e., piezoelectric thin films used as actuators. This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.

Technical details

Technical committee
SC 47F - Micro-electromechanical systems
SKU
IEC 62047-36:2019

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