Overview
IEC 62047-6:2009 is an international standard developed by the International Electrotechnical Commission (IEC) for the semiconductor and micro-electromechanical system (MEMS) industries. The standard specifies methods for axial fatigue testing of thin film materials used as primary structural elements in MEMS and micromachines. This standard covers specimens with lengths and widths under 1 mm and thicknesses between 0.1 µm and 10 µm, tested under constant force or constant displacement at room temperature in ambient air. By defining reliable methods for assessing the fatigue behavior of micro-scale thin films, IEC 62047-6:2009 helps ensure accuracy, repeatability, and comparability of mechanical test results in the field of semiconductor device manufacturing and MEMS design.
Key Topics
- Scope and Coverage: Testing focuses on micro-scale specimens fabricated similarly to actual device components, particularly deposited thin films.
- Specimen Preparation: Guidance on design, dimensions, and preparation of test pieces to minimize size effects and ensure specimen integrity.
- Test Conditions: Specifies axial tensile-tensile (cyclic) force fatigue testing, with thorough control of force, displacement, velocity, temperature, and humidity.
- Test Apparatus: Requirements for gripping mechanisms, alignment, control systems, and monitoring equipment to ensure proper application of cyclic load.
- Data Recording: Procedures for recording the number of cycles to failure, fracture characteristics, and relevant environmental conditions.
- Reporting Requirements: Details mandatory and optional information to be included in the fatigue test report, enhancing reliability and traceability.
Applications
IEC 62047-6:2009 is a critical resource for:
- MEMS Design and Reliability Testing: Used by engineers in MEMS and micromachine development to evaluate the fatigue life and durability of thin film elements in actuators, sensors, and microstructures.
- Semiconductor Manufacturing: Supports material scientists and process engineers in selecting and qualifying thin film materials for integrated circuit and MEMS applications.
- Quality Assurance and Research: Provides standardized methods for academic and industry research focused on the mechanical properties of thin films, enabling cross-institutional data comparison.
- Device Qualification: Facilitates device and material qualification, especially for products subjected to repeated mechanical loading during operation, such as in automotive, medical, and industrial sensor markets.
Practical implementation of IEC 62047-6 improves the reliability of micro-scale components by enabling detection of fatigue failure mechanisms early in the design cycle, aiding in the development of robust MEMS products.
Related Standards
- IEC 62047 Series: Covers a range of methods for mechanical and physical property testing of micro-electromechanical devices. Notable related parts include:
- IEC 62047-2: Tensile testing method of thin film materials-essential as a reference for specimen design and static testing procedures.
- ISO 1099: Metallic materials - Fatigue testing - Axial force-controlled method-for macro-scale materials, referenced for methodological foundation.
- ASTM E466: Standard practice for force-controlled constant amplitude axial fatigue testing of metallic materials.
- ISO 12107: Fatigue testing-statistical planning and analysis of data-guidance for determining test piece numbers and analyzing results.
By aligning with IEC 62047-6:2009 and related standards, organizations ensure their MEMS-related fatigue testing protocols meet international benchmarks, supporting global trade and collaboration.
Keywords: IEC 62047-6:2009, axial fatigue testing, thin film materials, MEMS standards, micro-electromechanical, semiconductor device testing, fatigue reliability, microstructure testing, thin film fatigue, standardization.
Open preview (PDF)Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials