Overview
IEC 62047-12:2011 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a bending fatigue testing method for thin film materials using resonant vibration of micro-electromechanical systems (MEMS) structures. This novel method targets the precise evaluation of mechanical fatigue properties of microscale materials by applying high cyclic frequency bending stress under resonant vibration. It addresses the unique characteristics of MEMS and micromachine structural materials, which typically range in size from a few microns to around 1 millimeter and exhibit high resonant frequencies and strength.
The main focus of IEC 62047-12 is to provide a standardized approach for ultra-high cycle fatigue testing (up to 10^12 cycles) on microscale thin film materials, facilitating faster and more reliable assessment of MEMS lifetime and durability. This is essential given the increasingly critical role of MEMS in modern electronics and semiconductor devices.
Key Topics
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Scope and Application
Applicable to microscale mechanical structures with plane dimensions from 10 µm to 1000 µm and thicknesses from 1 µm to 100 µm. The tested thin film materials typically range under 1 mm in overall dimensions, with thicknesses between 0.1 µm and 10 µm.
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Test Methodology
Utilizes resonant vibration to induce high-frequency bending stresses. The method exploits the resonant properties of MEMS structures to accelerate fatigue testing without compromising the accuracy of mechanical property evaluation.
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Test Equipment Components
- Actuators for vibration excitation
- Sensors for displacement or strain detection
- Controllers and recorders for feedback and data acquisition
- Parallel testing setups to optimize throughput
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Specimen Preparation
Specimens are manufactured using non-mechanical machining techniques such as photolithography and material deposition processes, reflecting typical MEMS fabrication methods.
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Test Conditions and Parameters
Parameters include test amplitude, load ratio, vibration frequency, waveform, test time, and controlled environmental conditions to simulate real-world usage.
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Measurement and Monitoring
Initial reference strength is established before testing. Continuous monitoring during testing ensures precise counting of fatigue cycles and accurate detection of failure points.
Applications
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MEMS Reliability and Lifetime Prediction
Using IEC 62047-12 facilitates accelerated fatigue life evaluation of MEMS components such as sensors, actuators, and micromachines, vital for consumer electronics, automotive systems, medical devices, and aerospace technologies.
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Thin Film Material Research and Development
Enables manufacturers and researchers to assess new thin film materials and deposition techniques with regard to fatigue performance at microscale dimensions.
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Quality Assurance in Semiconductor Manufacturing
Helps semiconductor device producers ensure consistent strength and durability of micro-electromechanical structures, reducing failures in final products.
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Design Optimization
Supports iterative design improvements by providing reliable fatigue data, leading to enhanced material selection and structural configurations for MEMS devices.
Related Standards
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IEC 62047-3:2006
Thin film standard test piece for tensile testing – complements IEC 62047-12 by providing foundational tensile test methods for micro-electromechanical devices.
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ISO 12107
Metallic materials – Fatigue testing – Statistical planning and data analysis – offers methodologies for fatigue testing and statistical evaluation applicable to microscale materials as adapted in IEC 62047-12.
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Other Parts of IEC 62047 Series
The IEC 62047 series covers various aspects of semiconductor and MEMS device testing, each addressing specific mechanical and electrical evaluation methods.
By adopting IEC 62047-12:2011, organizations can ensure standardized, efficient, and high-precision fatigue testing of MEMS thin films, directly supporting the development of robust semiconductor and micro-electromechanical devices tailored for high-performance applications. This standard is an essential resource for engineers, researchers, and manufacturers involved in the advancement of microscale device technologies.
Open preview (PDF)Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
