Overview
IEC 62047-3:2006 is an international standard published by the International Electrotechnical Commission (IEC) that specifies requirements for a standard test piece used in tensile testing of thin film materials. These materials, with dimensions under 1 mm in length and width and under 10 µm in thickness, are widely utilized as the principal structural components in micro-electromechanical systems (MEMS), micromachines, and related semiconductor devices.
This standard ensures the accuracy and propriety of tensile testing systems by defining the characteristics of standard test pieces whose tensile strength has been predetermined. By minimizing variation among test pieces and providing clear guidelines for fabrication and measurement, IEC 62047-3 plays a crucial role in the quality assurance of thin film materials testing, which is essential for reliable MEMS device development and semiconductor processes.
Key Topics
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Standard Test Piece Characteristics
Specifies dimensions, materials, and gauge marking requirements for the thin film test pieces, including accuracy ranges and surface quality to avoid measurement errors and stress-concentration failure.
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Test Piece Fabrication
Details the fabrication process, calling for deposition and patterning techniques to be carried out under controlled specifications to ensure consistency across samples.
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Thickness Measurement
Outlines direct and non-contact methods for measuring test piece thickness with a high degree of accuracy (within ±1%), to minimize measurement-induced errors and reflect true material characteristics.
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Material Guidelines
Indicates the use of materials with well-known mechanical properties, such as single crystal silicon. For systems designed to test ductile materials, relevant ductile substances may also be used.
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Test Procedures
Requires that tensile tests be performed on at least ten standard test pieces fabricated under the same conditions, with evaluation based on average values and standard deviations for tensile strength, Young’s modulus, and elongation.
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Documentation
Specifies the necessary documentation to accompany each test piece batch, including reference to the standard, sample identification, material data, dimensions, and expected mechanical properties.
Applications
The standard finds practical application in various fields where the mechanical integrity of micro-scale thin films is critical:
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MEMS and Micromachines
Validating mechanical properties of thin film structures that serve as sensors, actuators, and other microsystem elements.
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Semiconductor Manufacturing
Ensuring process control and material reliability for device components manufactured using thin films.
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Materials Research and Quality Control
Providing a consistent and reproducible method to benchmark and improve the tensile testing apparatus and procedures for thin films.
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Device Reliability Assessment
Supporting the qualification and prediction of device lifetime where thin films experience mechanical stresses during operation.
Related Standards
For complete and accurate implementation, IEC 62047-3:2006 references and should be used in conjunction with:
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IEC 62047-2: Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Defines the tensile testing procedures applied to thin film materials.
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ISO 17561: Fine ceramics (advanced ceramics, advanced technical ceramics) - Test method for elastic moduli of monolithic ceramics at room temperature by sonic resonance
Provides methods for determining Young’s modulus, especially where a clear linear region in the stress-strain curve is absent.
Other parts of the IEC 62047 series cover a broader range of test methods and specifications for semiconductor micro-electromechanical devices.
Integrating IEC 62047-3 into laboratory and manufacturing practice boosts the reliability and comparability of thin film mechanical property measurements for microelectronics, MEMS, and nanoscale applications. Following these standardized procedures supports both product development and ongoing quality assurance.
Open preview (PDF)Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
