Overview
IEC 62047-22:2014 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies an electromechanical tensile test method for conductive thin films deposited on flexible substrates. These thin films are integral components in micro-electromechanical systems (MEMS), flexible electronics, and various consumer products. The standard focuses on measuring the electromechanical properties of conductive thin micro-electromechanical materials that are bonded on non-conductive, flexible substrates. Due to their composite structure and interfacial interactions, the electrical behavior of these films differs significantly from standalone films or substrates.
This standard addresses unique challenges presented by thin conductive films on flexible materials, where the film thickness is typically 50 times thinner than that of the substrate, but other dimensions such as length and width remain comparable. IEC 62047-22:2014 provides methods to obtain reliable measurement data crucial for research, product development, and quality assurance in flexible MEMS device fabrication.
Key Topics
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Scope and Application
The standard applies to tensile testing of conductive thin films bonded to flexible, non-conductive substrates. It is relevant for MEMS devices, flexible electronics, and advanced consumer products where flexible thin films enhance device functionality.
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Test Piece Design
Test specimens are bilayered, consisting of a conductive thin film and a flexible substrate. The standard defines the shape and dimensions necessary to ensure uniform strain distribution during tensile testing.
- The gauge length must be at least 20 times the test piece width to eliminate boundary effects near grips.
- Thickness measurements of both layers require precision within ±5% error.
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Electromechanical Testing Method
- The test machine and apparatus include specialized tensile grips designed to secure lead wires without causing detachment or damage during testing.
- Electrical resistance measurements are taken under strain to determine gauge factors and elongation at electrical failure.
- The electrical resistance changes relative to strain provide insights into the film's electromechanical properties.
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Data Analysis and Reporting
- Dimensions of the test pieces are precisely measured to calculate mechanical properties accurately.
- Parameters such as gauge factor (ratio of resistance change to strain) and engineering strain at electrical failure are key performance indicators logged in test reports.
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Normative References
The standard builds on related IEC documents including IEC 62047-2 (tensile testing methods for thin films), IEC 62047-3 (standard test piece shapes), and IEC 62047-8 (strip bending methods), ensuring consistency across MEMS testing guidelines.
Applications
IEC 62047-22:2014 is essential for industries and research fields involving:
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Flexible Electronics Manufacturing
Ensuring reliability and performance of thin conductive films used in wearable devices, flexible displays, and electronic textiles.
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MEMS Device Development
Characterizing conductive films in sensors, actuators, and micro-switches that require flexibility and electromechanical integrity.
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Consumer Product Engineering
Validating the durability and electrical performance of thin films integrated into consumer gadgets exposed to mechanical deformation.
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Research and Material Development
Studying the interfacial effects, substrate-film interactions, and enhancement of conductive thin film materials for emerging applications.
By standardizing the tensile testing process and defining precise measurement methods, this IEC standard facilitates improved product quality, durability, and innovation in flexible thin film technologies.
Related Standards
- IEC 62047-2:2006 – Tensile testing methods for thin film materials in MEMS
- IEC 62047-3:2006 – Thin film standard test piece shapes for tensile testing
- IEC 62047-8:2011 – Strip bending test method for tensile property measurement of thin films
- ISO 527-3:1995 – Plastics - Determination of tensile properties for films and sheets
These complementary standards provide broader context and additional methodologies for assessing mechanical and electromechanical characteristics of micro-electromechanical and flexible thin film materials.
By adhering to IEC 62047-22:2014, manufacturers and researchers can ensure accurate and reproducible evaluation of conductive thin films on flexible substrates, promoting innovation and reliability in the rapidly advancing flexible electronics and MEMS fields.
Open preview (PDF)Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
